Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 82 items
Significantly reduce the bending of large panel masks!!
<Features> This is a vertical exposure device for masks that minimizes the bending of large panel masks. It performs exposure of multi-faceted, large panels in X-steps with high alignment accuracy. The device features precise temperature control for both the mask and the panel, resulting in a reduced total pitch.
High-precision alignment with an independent optical system and lighting!!!
<Features> Supports touch panels from 4.5G (920*730mm) to 6G (1500*1850mm). Provides optimal modes for ITO, OC1, metal, and OC2 processes. Aligns unclear ITO marks and metal-covered marks with high precision using a unique optical system and lighting. Panel transport is vertical, non-contact, and compatible with thin panels. Standard equipped with a mask changer (5-10 sheets) to support clean patterning.
Provides high alignment capability with its unique optical system, lighting, and image processing!!!
<Features> We offer a lineup of horizontal exposure devices ranging from 2G to 3.5G. Transport is achieved through high-speed shuttle transport or robot transport, contributing to high throughput production. Additionally, we provide high alignment capability for hard-to-see ITO marks and metal-covered marks through our unique optical system, lighting, and image processing. With temperature control of the mask and workpiece, we achieve a total pitch of ±3-5μm.
Significantly reduce the labor involved in roll-to-roll transportation!!!
<Features> We offer single-sided or double-sided exposure for film devices such as 3D, touch panels, FPC, and OLED.
Convenient manual aligners for research and development!!!
<Features> We provide a manual aligner with high precision and user-friendly design for research and development.
Alignment accuracy = ±1μm or less!!!
<Features> Provides high-precision patterning and alignment accuracy suitable for prototype mass production.
Fully automatic type (2 to 12 inch and square type, etc.) wafer exposure equipment
Overview Adopts a unique UV optical system optimized for high-precision exposure and a mechanism that can align photomasks and wafers with high accuracy. Fully automatic exposure equipment compatible with vacuum contact, soft contact, and proximity, with custom options available.
A rich lineup of UV exposure devices, including dual-sided exposure compatible machines! Supporting everything from R&D to mass production.
The "UV Exposure Equipment" offers a range from manual to semi/full automatic models, including those compatible with double-sided exposure. With a rich product lineup, we can support everything from R&D to mass production. Our equipment is used in various applications such as semiconductor devices, MEMS devices, and microfluidic chips. We also sell UV light sources only. 【Product Lineup】 ■ Contact Mask Aligner: Model 200 ■ Double-Sided Exposure Compatible Mask Aligner: Model 800MBA ■ Double-Sided Exposure Compatible Mask Aligner: Model 6000 ■ UV Light Source: Series 30 *For more details, please refer to the PDF document or feel free to contact us.
Achieving resolution beyond the diffraction limit! An exposure system that can create periodic structures at low cost.
The "PhableR 100" is a low-cost exposure system capable of producing high-resolution periodic structures. Photoresist is coated, and a mask is set in proximity for exposure. Thanks to unique technology, it achieves resolution beyond the diffraction limit. It can create sub-micron scale gratings and 2D patterns in hexagonal and triangular arrangements. 【Features】 ■ High resolution with a pitch of 300nm or less ■ Achieves a pitch of 150nm with DUV light source selection ■ Full-area exposure ■ Non-contact: protects the mask from damage and contamination ■ Virtually unlimited depth direction focus *For more details, please refer to the PDF document or feel free to contact us.
High-strength exposure device guaranteed for parallelism.
This is an exposure device that uses a 2kW ultra-high pressure mercury lamp. It can be controlled from dedicated PC software, and it is also capable of adjusting the mask flatness and the gap with the glass. This is the exposure printing equipment with the guaranteed parallelism. 2kW extra-high pressure mercury lamp is equipped. It can be controlled with the designated PC software and the shutter controller. It can adjust a gap to the glass and flatten the photomask. It can expose lights with sophisticated patterns. We can customize the size of photomask or other features.
Easy setup, automatic parallel adjustment, complete non-contact gap management. Auto mask aligner with auto-alignment feature. Custom-made options available!
The product is an auto batch equal magnification exposure mask alignment device. It performs automatic parallel adjustment of the photomask and wafer in a completely non-contact manner. Equipped with a super-precise UVW drive stage and high-performance image processing, it accurately aligns the photomask and wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. 【Features】 ■ Complete non-contact parallel alignment and exposure of photomask and wafer ■ Auto alignment function ■ Easy setup changes, compatible with multiple substrate sizes ■ Space-saving and easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Equipped with a super-precise UVW stage *For more details, please refer to the PDF document or feel free to contact us.
Supports up to 12-inch wafers! Direct drawing compatible with general-purpose CAD eliminates the costs and time associated with photomask production!
◆Solving the Challenges of Photolithography with Direct Drawing The maskless exposure device performs direct drawing on the workpiece using a DMD (Digital Micromirror Device). By eliminating the enormous costs and time required for photomask production, the challenges of traditional photolithography processes are resolved, making the prototyping of semiconductor devices more accessible. ◆Selectable Exposure Modes Since 2016, a fine exposure mode utilizing pixel interpolation technology has been standard. While the throughput time is longer compared to the standard exposure mode, the data reproducibility of diagonal lines and curved patterns is significantly improved. ◇What is DMD? DMD refers to hundreds of thousands of tiny mirrors arranged in a grid pattern. By illuminating these mirrors and controlling each one ON/OFF, image data created with general-purpose CAD is projected onto the workpiece. The light source uses LED light, which is long-lasting and economical.
Pattern exposure at matching positions on the front and back of samples with different processes.
The BA series backside mask alignment exposure device is a low-cost mask alignment system that enables alignment from the backside of the sample, which was difficult with conventional exposure devices. It can also be used as a standard single-sided exposure mask aligner, supporting the development of various MEMS and semiconductor devices with double-sided configurations. This device allows for the alignment and exposure of mask patterns to specified positions on the opposite side (the second side) of the sample, relative to pre-formed alignment marks on the first side. For more details, please contact us or refer to the catalog.
Device for forming circuits on flexible printed circuit boards (FPC).
We have a lineup of products that use roll-to-roll pitch feeding to imprint patterns onto dry film.
Here is the lineup of parallel light exposure devices.
As a uniform irradiation light source, it is used for various applications such as precision pattern exposure, pattern exposure of semiconductor device elements, and wafer exposure.
